XperYenZ™. Paving the way for sensing applications that have never been possible before.

MEET US AT MOBILE WORLD CONGRESS 2018

The trinamiX team will be in Barcelona at MWC from Feb 26 - March 1. Meet us there and see our latest development: 3D imaging technology for the integration into smartphones.

TECHNOLOGY

XperYenZ™ sensor systems determine distance from beam profile properties. Paving the way for sensing applications that have never been possible before.

CAREER

We are not looking for followers. We are looking for pioneers.

HERTZSTÜCK™

Bondable bare chip IR-sensors with new thin-film encapsulation.